FR4 8 layer gold finger plating pcb

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Product Details

FR4 8 layer gold finger plating pcb

Our Factory Manufacture Capability

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based/FR1/CEM1/FPC
Layer No.	1-- 20
Finished Board thickness	0.2 mm-4.0mm’(8 mil-160 mil)
Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-6OZ (18 um-210 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp &Twist	0.50%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Images
Min Trace Width	0.075mm (3mil)
Min Space Width	0.075mm (3mil)
Min Annular Ring	0.1mm (4 mil)
Solder Mask
Min Solder Mask Dam	0.0635 mm (2.5mil)
Solder mask Clearance	0.1mm (4 mil)
Holes
Min Hole size (CNC)	0.1 mm (4 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Certificate	ROHS, SGS, UL, ISO9001: 2008,TS16949

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Shenzhen Shenyixin Electronics Co., Ltd.: Contact nameAmily Peng
Chat Now; Phone86-0755-29634680; AddressNO.48, Gonghe Road , Xixiang Town , Bao'an District ,, Shenzhen, Guangdong

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